2830 ZT Wafer Analyzer

Advanced wavelength dispersive XRF analysis

The 2830 ZT wavelength dispersive X-ray fluorescence (WDXRF) Wafer Analyzer offers the ultimate capability for measuring film thickness and composition. Designed specifically for the semiconductor and data storage industry, PANalytical’s 2830 ZT Wafer Analyzer enables the determination of layer composition, thickness, dopant levels and surface uniformity for a wide range of wafers up to 300 mm.

Continuous capability and speed

The 4 kW SST-mAX X-ray tube features groundbreaking ZETA Technology which eliminates the effects of X-ray tube aging. ‘New tube’ performance is maintained throughout the tube’s lifetime. Together with high sensitivity, ZETA Technology ensures that rapid analysis and short measurement times are maintained across the lifetime of the tube. ZETA technology strongly reduces the need for drift correction and recalibration which increases productivity and uptime of the instrument.

Maximized uptime

Conventional X-ray tubes suffer tungsten evaporation, which causes deposits on the inside of the tube’s beryllium window. Instrumentation using such X-ray tubes requires regular drift correction to compensate for decreasing intensity, especially for light elements.

Implementation of the SST-mAX in the 2830 ZT solves this drift problem, thereby maximizing uptime and maintaining instrument precision over time.

Superior light element performance

Key features to maximizing sensitivity and stability of 2830 ZT for light elements include:

• 4 kW output SST-mAX, operating at a high current of 160 mA
• Dedicated high-performance channels for light elements in the range from boron to magnesium
• Dry (oil-free) pumps maintaining a clean, sub-Pascal vacuum within the measurement chamber
  
  

The 2830 ZT is supplied with PANalytical’s advanced SuperQ software, which includes FP Multi. The intuitive user interface ensures that even inexperienced operators can carry out fully automated fundamental parameter analysis of multi-layers.

The instrument's SuperQ software has a wide range of easy-to-use modules designed for flexible operation by researchers and engineers. Changing between recipes is easy, as is adjusting equipment parameters to suit user preferences. 

Benefits:

Fast and cost-effective multi-layer analysis

• Powerful Fundamental Parameter software
• Simultaneous measurement of up to 24 elements on stacks of up to 16 layers

Seamless fab integration

• Efficient, compact system design
• From manual wafer loading to fully automated
• Compliance with all relevant standards