Development and manufacturing of data storage devices require unprecedented control of extremely thin layers (<1nm). XRF and XRR can both meet the challenging requirement for accurate thin film metrology. These proven techniques provide rapid, non-destructive, reliable and accurate access to critical thin film parameters.
PANalytical: a reliable partner for data storage industries
PANalytcial provides non-destructive metrology tools for the rapid evaluation of essential properties in modern multi-stack data storage components. Solutions are available for either research and development (R&D) or in- line process control. :
- The 2830 ZT determines composition and thickness, contamination, dopant levels and surface uniformity for semiconductor films and stacks, by measuring elements from Be to U. In addition to best in class precision, the 2830 ZT offers unprecedented uptime as a result of the elimination of tube intensity drift through ZETA Technology. Through this unique feature, calibration maintenance and drift correction is minimized, and system uptime is maximized.
- The Semyos is designed for on-product, in-line process control for thin films and stacks, for elements from Al onwards. The spot size of less than 23 µm FWHM (Full Width, Half Max) allows measurements to be performed on dedicated metrology areas in scribe lines on product wafers. The system comes with pattern recognition software included
- State-of the art X-ray reflectometry solutions are based on X’Pert PRO MRD (XL) offering the benefits of bright X-ray sources, reliable X-ray optics, ultra-high dynamic detectors and X-ray data modeling with the last recent scientific algorithms. Thickness, density and roughness can be quantified accurately and absolute
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