The standard research and development version for use with thin film samples, wafers (complete mapping up to 100 mm) and solid materials. High-resolution analysis capability is improved by the outstanding accuracy of a new high-resolution goniometer using Heidenhain encoders.
X'Pert³ MRD XL
The X'Pert³ MRD XL meets all the high-resolution XRD analysis requirements of the semiconductors, thin films, and advanced materials industries. Complete wafer mapping up to 200 mm is possible. The X’Pert3 version comes with longest liftetime of incident beam components (CRISP) and maximum uptime with pneumatic shutters and beam attenuators.
By facilitating analysis of wafers of up to 300 mm in diameter, with a sophisticated, automatic wafer loader option, the X'Pert³ MRD XL becomes an advanced tool for quality control of industrial thin layered structures.
X'Pert³ Extended MRD (XL)
The X'Pert³ Extended MRD (XL) brings increased versatility to the range of X'Pert³ MRD systems. An extra PreFIX mounting platform allows mounting of an X-ray mirror and a high-resolution monochromator in-line, increasing significantly the intensity of the incident beam.
One can benefit from increased application versatility without compromise on data quality, high-resolution X-ray diffraction with high intensities, shorter measurement times for measurements such as reciprocal space mapping and rebuild from standard to extended configuration in minutes thanks to the PreFIX concept. With the 2nd generation PreFIX, reconfiguring is easy and optics positioning is more accurate than ever.
X'Pert³ MRD (XL) In-plane
With the X'Pert³ MRD (XL) system for in-plane diffraction, it becomes possible to measure diffraction from lattice planes that are perpendicular to the sample surface.
Standard and in-plane geometries on one system and a wide range of diffraction experiments on polycrystalline and highly perfect thin films, are just two of many benefits.